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panasonic corporation automation controls business unit industrial.panasonic.com/ac/e/ axk7, 8 acctb3e 201212-t for board-to-board for board-to-fpc p4 series narrow pitch connectors (0.4mm pitch) ?without soldering terminals features 1. 0.4 mm pitch and mated heights of 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm. 2. strong resistance to adverse environments! utilizes construction for high contact reliability. 3. constructed with impact dispersion keys inside the body to disperse shocks when dropped. a high level of shock resistance is ensured by dispersing impact over the four locations where the socket indentations and header protrusions are mated together. note: the following number of pins are not supported due to suction surface factors. ? without soldering terminals: 18 pin contacts or less 4. construction makes designing de vices easier. 1) the lower connector bottom surface construction prevents contact and shorts between the pcb and metal terminals. this enables freedom in pattern wiring, helping to make pcbs smaller. 2) guides are provided to take up any position shift and facilitate insertion. 3) simple lock structure provides tactile feedback to ensure excellent mating/ unmating operation feel. 5. design facilitates ef?ient mounting. features a terminal flatness of 0.08 mm, construction resistant to creeping flux, and design that allows visual inspection of the soldered part. 6. connectors for inspection available applications mobile devices, such as cellular phones, digital still cameras and digital video cameras. socket header 3.96mm 5.1mm rohs compliant impact dispersion key so cket header connector bottom: create any thru-hole and pattern wiring.

insertion guide socket side contact header side contact simple lock mechanism
panasonic corporation automation controls business unit industrial.panasonic.com/ac/e/ axk7, 8 acctb3e 201212-t ordering information mated height 1: for mated height 1.5 mm 2: for mated height 2.0 mm 3: for mated height 2.5 mm and 3.0 mm 4: for mated height 3.5 mm

1: for mated height 1.5 mm, 2.0 mm and 2.5 mm 2: for mated height 3.0 mm and 3.5 mm surface treatment (contact portion / terminal portion) 7: ni plating on base, au plating on surface (for ni barrier available)

5: ni plating on base, au plating on surface other specifications

w: v notch and post edge horseshoe bend type product number of pins (2 digits) pac king g: 3,000 pieces embossed tape and plastic reel 2 ? 7: narrow pitch connector p4 (0.4 mm pitch) socket 8: narrow pitch connector p4 (0.4 mm pitch) header functions 4: without soldering terminals, without positioning bosses axk 4 g notes: 1. only a socket of mated height 3.5 mm: 2,000 pieces embossed tape and plastic reel 2. 2. please note that the models with a soldering terminals (8th digit of part number is 2) and those without a soldering terminals (8th digit of part number is 4) are shaped differently and are not compatible.
panasonic corporation automation controls business unit industrial.panasonic.com/ac/e/ axk7, 8 acctb3e 201212-t product types without soldering terminals notes: 1. regarding ordering units; during production: please make orders in 1-reel units. samples for mounting confi mation: available in units of 50 pieces. please consult us. (see regarding sample orders to confi m proper mounting on page 169.) samples: small lot orders are possible. 2. the above part numbers are for connectors without positioning bosses, which are standard. when ordering connectors with positioning bosses, please contact our sales offic . 3. different number of pins are available on-demand production only. please contact us for more details. mated height number of pins pa rt number pac king so cket header inner carton outer carton 1.5 mm 14 axk714147g axk814145wg 3,000 pieces 6,000 pieces 20 axk720147g axk820145wg 22 axk722147g axk822145wg 24 axk724147g axk824145wg 26 axk726147g axk826145wg 30 axk730147g axk830145wg 34 axk734147g axk834145wg 40 axk740147g axk840145wg 44 axk744147g axk844145wg 50 axk750147g axk850145wg 54 axk754147g axk854145wg 60 axk760147g axk860145wg 64 axk764147g axk864145wg 70 axk770147g axk870145wg 80 AXK780147G axk880145wg 100 axk700147g axk800145wg 2.0 mm 14 axk714247g axk814145wg 20 axk720247g axk820145wg 24 axk724247g axk824145wg 26 axk726247g axk826145wg 30 axk730247g axk830145wg 40 axk740247g axk840145wg 50 axk750247g axk850145wg 60 axk760247g axk860145wg 70 axk770247g axk870145wg 80 axk780247g axk880145wg 2.5 mm 14 axk714347g axk814145wg 20 axk720347g axk820145wg 24 axk724347g axk824145wg 30 axk730347g axk830145wg 40 axk740347g axk840145wg 50 axk750347g axk850145wg 60 axk760347g axk860145wg 70 axk770347g axk870145wg 80 axk780347g axk880145wg 3.0 mm 20 axk720347g axk820245wg 24 axk724347g axk824245wg 30 axk730347g axk830245wg 40 axk740347g axk840245wg 50 axk750347g axk850245wg 60 axk760347g axk860245wg 80 axk780347g axk880245wg 3.5 mm 20 axk720447g axk820245wg socket: 2,000 pieces header: 3,000 pieces socket: 4,000 pieces header: 6,000 pieces 30 axk730447g axk830245wg 40 axk740447g axk840245wg
panasonic corporation automation controls business unit industrial.panasonic.com/ac/e/ axk7, 8 acctb3e 201212-t specifications 1. characteristics 2. material and surface treatment item specification conditions electrical characteristics rated current 0.3a/pin contact (max. 5 a at total pin contacts) rated voltage 60v ac/dc breakdown voltage 150v ac for 1 min. detection current: 1ma insulation resistance min. 1,000m ? (initial) using 250v dc megger (applied for 1 min.) contact resistance max. 70m ? based on the contact resistance measurement method specified y jis c 5402. mechanical characteristics composite insertion force max. 0.981n {100gf}/pin contacts pin contacts (initial) composite removal force min. 0.0588n {6gf}/pin contacts pin contacts (mated height 1.5 mm without soldering terminals type) min. 0.118n {12gf}/pin contacts pin contacts all the other types except the above (mated height 1.5 mm without soldering terminals type) post holding force min. 0.981n {100gf}/pin contacts measuring the maximum force. as the contact is axially pull out. environmental characteristics ambient temperature C55 c to +85 c no freezing at low temperatures soldering heat resistance max. peak temperature of 260 c (on the surface of the pc board around the connector terminals) infrared refl w soldering 300 c within 5 sec. 350 c within 3 sec. soldering iron storage temperature C55c to +85 c (product only) C40c to +50 c (emboss packing) no freezing at low temperatures. no dew condensation. thermal shock resistance (header and socket mated) 5 cycles, insulation resistance min. 100m ?, contact resistance max. 70m ? conformed to mil-std-202f, method 107g humidity resistance (header and socket mated) 120 hours, insulation resistance min. 100m ?, contact resistance max. 70m ? bath temperature 40 2c, humidity 90 to 95% r.h. saltwater spray resistance (header and socket mated) 24 hours, insulation resistance min. 100m ?, contact resistance max. 70m ? bath temperature 35 2c, saltwater concentration 5 1% h 2 s resistance (header and socket mated) 48 hours, contact resistance max. 70m ? bath temperature 40 2c, gas concentration 3 1 ppm, humidity 75 to 80% r.h. lifetime characteristics insertion and removal life 50 times repeated insertion and removal speed of max. 200 times/hours unit weight mated height 1.5mm, 20 pin contacts; socket: 0.04g header: 0.02g pa rt name material surface treatment molded portion lcp resin (ul94v-0) contact and post copper alloy contact portion: ni plating on base, au plating on surface te r minal portion: ni plating on base, au plating on surface (except for thick of terminal) however, upper terminal of ni barrier production: exposed over ni the area adjacent to the terminal of the sockets on models with ni barrier is exposed to ni on base. soldering terminals portion copper alloy ni plating on base, sn plating on surface (except for front terminal) order temperature ( c) time (minutes) 1 2 3 4 C55 85 C55 0 ?3 30 max. 5 30 max. 5 +3 0 0 ?3
panasonic corporation automation controls business unit industrial.panasonic.com/ac/e/ axk7, 8 acctb3e 201212-t dimensions (unit: mm) socket and header are mated the cad data of the products with a cad data mark can be downloaded from: http://industrial.panasonic.com/ac/e/ without soldering terminals socket (mated height: 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm) 1.11 e 0.150.03 4.10 0.400.05 0.400.05 a b0.1 0.08 5.10 3.75 (0.675) (0.675) c 0.80 0.80 (suction face) d max. 18 pin contacts general tolerance: 0.2 dimension table (mm) number of pins/ dimension a b c d 14 5.1 2.4 2.8 20 6.3 3.6 1.6 22 6.7 4.0 2.0 24 7.1 4.4 2.4 26 7.5 4.8 2.8 30 8.3 5.6 3.6 34 9.1 6.4 4.4 40 10.3 7.6 5.6 44 11.1 8.4 6.4 50 12.3 9.6 7.6 54 13.1 10.4 8.4 60 14.3 11.6 9.6 64 15.1 12.4 10.4 70 16.3 13.6 11.6 80 18.3 15.6 13.6 100 22.3 19.6 17.6 mated height/dimension e 1.5mm 1.50 2.0mm 1.92 2.5mm, 3.0mm 2.42 3.5mm 2.92 cad data header (mated height: 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm) 0.08 c 0.76 0.76 f (suction face) 2.66 3.96 b0.1 a 0.400.05 0.400.05 0.150.03 (0.42) (0.42) 3.96 3.12 2.19 e 0.100.03 d max. 18 pin contacts general tolerance: 0.2 dimension table (mm) number of pins/ dimension a b c d 14 3.9 2.4 3.04 20 5.1 3.6 1.6 22 5.5 4.0 2.0 24 5.9 4.4 2.4 26 6.3 4.8 2.8 30 7.1 5.6 3.6 34 7.9 6.4 4.4 40 9.1 7.6 5.6 44 9.9 8.4 6.4 50 11.1 9.6 7.6 54 11.9 10.4 8.4 60 13.1 11.6 9.6 64 13.9 12.4 10.4 70 15.1 13.6 11.6 80 17.1 15.6 13.6 100 21.1 19.6 17.6 mated height/dimension e f 1.5mm, 2.0mm, 2.5mm 1.31 1.20 3.0mm, 3.5mm 2.26 1.26 cad data 3.500.15 3.000.15 2.500.15 2.000.15 1.500.15
panasonic corporation automation controls business unit industrial.panasonic.com/ac/e/ axk7, 8 acctb3e 201212-t embossed tape dimensions (unit: mm, common for respective contact type, socket and header) dimension table (mm) without soldering terminals connector orientation with respect to direction of progress of embossed tape without soldering terminals mated height number of pins type of taping a b c d quantity per reel so cket header common for socket and header: 1.5 mm, 2.0 mm, 2.5 mm and 3.0 mm header: 3.5 mm max. 18 max. 18 tape i 16.0 7.5 17.4 3,000 20 to 70 20 to 70 tape i 24.0 11.5 25.4 3,000 80 to 100 80 to 100 tape ii 32.0 28.4 14.2 33.4 3,000 socket: 3.5 mm 20 to 40 tape i 24.0 11.5 25.4 2,000 ?tape dimensions (conforming to jis c 0806-1990. however, some tapes have mounting hole pitches that do not comply with the standard.) tape i tape ii 1.75 c 8.0 a0.3 4 2 1.5 dia. +0.1 0 pull out direction 1.75 c 8.0 a0.3 4 2 pull out direction b 1.5 dia. +0.1 0 plastic reel dimensions (conforming to eiaj et-7200b) d1 top cover tape taping reel embossed carrier tape embossed mounting-hole 380 dia. type direction of tape progress common for p4 socket header note: there is no indication on this product regarding top-bottom or left-right orientation.
panasonic corporation automation controls business unit industrial.panasonic.com/ac/e/ axk7, 8 acctb3e 201212-t table of product types ?: av ailable for sale notes: 1. you can use with each mated height in common. 2. please inquire about number of pins other than those shown above. 3. please inquire with us regarding availability. 4. please keep the minimum order quantities no less than 50 pieces per lot. 5. please inquire if further information is needed. product types notes: 1. when placing an order, substitute the (asterisk) in the above part number with the number of pins for the specific connecto . 2. the above part numbers are for connectors without positioning bosses, which are standard. when ordering connectors with positioning bosses, please contact our local sales offic . for board-to-board for board-to-fpc p4 series connectors for inspection usage (0.4mm pitch) product name number of pins 14 20 22 24 26 30 34 40 44 50 54 60 64 70 80 100 p4 for inspection without soldering terminals ? ?? ?? ?? ?? ?? ?? ?? ? specification part no. specification part no. so cket without soldering terminals without positioning bosses axk7e 46g header without soldering terminals without positioning bosses axk8e 46wg features 1. 3,000 mating and unmating cycles 2. same external dimensions and foot pattern as standard type. 3. improved mating insertion and removal easy due to a reduction in mating retention force. this is made possible by a simple locking structure design. note: mating retention force cannot be warranted. applications ideal for module unit inspection and equipment assembly inspection socket header 3.96mm 5.1mm rohs compliant
panasonic corporation automation controls business unit industrial.panasonic.com/ac/e/ axk7, 8 acctb3e 201212-t notes 1. as shown below, excess force during insertion may result in damage to the connector or removal of the solder. also, to prevent connector damage please con?m the correct position before mating connectors. 2. keep the pc board warp no more than 0.03 mm in relation to the overall length of the connector. 3. recommended pc board and metal mask patterns connectors are mounted with high pitch density, intervals of 0.35 mm, 0.4 mm or 0.5 mm. in order to reduce solder bridges and other issues make sure the proper levels of solder is used. the figures to the right are recommended metal mask patterns. please use them as a reference. without soldering terminals so cket recommended pc board pattern (top view) recommended metal mask pattern metal mask thickness: here, 150 m (opening area ratio: 40%) recommended metal mask pattern metal mask thickness: here, 120 m (opening area ratio: 50%) header recommended pc board pattern (top view) recommended metal mask pattern metal mask thickness: here, 150 m (opening area ratio: 32%) recommended metal mask pattern metal mask thickness: here, 120 m (opening area ratio: 40%) max. 0.03 mm max. 0.03 mm 0.1150.05 0.400.05 0.40 0.05 0.400.05 0.230.03 5.700.05 3.500.05 5.500.01 4.480.01 (0.51) 0.100.01 0.350.01 0.200.01 0.400.01 (0.51) (0.63) (0.63) 0.400.01 0.200.01 5.500.01 4.240.01 0.100.01 0.350.01 0.400.05 0.400.05 0.230.03 2.960.05 0.1150.05 0.400.05 4.560.05 4.100.01 3.500.01 (0.30) (0.30) 0.200.01 0.400.01 0.100.01 0.350.01 0.200.01 0.400.01 (0.37) (0.37) 4.100.01 3.360.01 0.100.01 0.350.01 please refer to the latest product specifications when designing our product.
panasonic corporation automation controls business unit industrial.panasonic.com/ac/e/ notes on using narrow-pitch connectors (common) acctb48e 201204-t regarding the design of devices and pc board patterns regarding the selection of the connector placement machine and the mounting procedures notes on using narrow-pitch connectors (common) 1) when connecting several connectors together by stacking, make sure to maintain proper accuracy in the design of structure and mounting equipment so that the connectors are not subjected to twisting and torsional forces. 2) with mounting equipment, there may be up to a 0.2 to 0.3-mm error in positioning. be sure to design pc boards and patterns while taking into consideration the performance and abilities of the required equipment. 3) some connectors have tabs embossed on the body to aid in positioning. when using these connectors, make sure that the pc board is designed with positioning holes to match these tabs. 4) to ensure the required mechanical strength when soldering the connector terminals, make sure the pc board meets recommended pc board pattern design dimensions given. 5) for all connectors of the narrow-pitch series, to prevent the pc board from coming off during vibrations or impacts, and to prevent loads from falling directly on the soldered portions, be sure to design some means to ? the pc board in place. example) secure in place with screws when connecting pc boards, take appropriate measures to prevent the connector from coming off. 6) notes when using a fpc. (1) when the connector is soldered to an fpc board, during its insertion and removal procedures, forces may be applied to the terminals and cause the soldering to come off. it is recommended to use a reinforcement board on the backside of the fpc board to which the connector is being connected. please make the reinforcement board dimensions bigger than the outer limits of the recommended pc board pattern (should be approximately 1 mm greater than the outer limit). material should be glass epoxy or polyimide, and the thickness should be between 0.2 and 0.3 mm. (2) collisions, impacts, or turning of fpc boards, may apply forces on the connector and cause it to come loose. therefore, make to design retaining plates or screws that will ? the connector in place. 7) the narrow-pitch connector series is designed to be compact and thin. although ease of handling has been taken into account, take care when mating the connectors, as displacement or angled mating could damage or deform the connector. connector spacer spacer pc board screw 1) select the placement machine taking into consideration the connector height, required positioning accuracy, and packaging conditions. 2) be aware that if the catching force of the placement machine is too great, it may deform the shape of the connector body or connector terminals. 3) be aware that during mounting, external forces may be applied to the connector contact surfaces and terminals and cause deformations. 4) depending on the size of the connector being used, self alignment may not be possible. in such cases, be sure to carefully position the terminal with the pc board pattern. 5) the positioning bosses give an approximate alignment for positioning on the pc board. for accurate positioning of the connector when mounting it to the pc board, we recommend using an automatic positioning machine. 6) excessive mounter chucking force may deform the molded or metal part of the connector. consult us in advance if chucking is to be applied.
panasonic corporation automation controls business unit industrial.panasonic.com/ac/e/ notes on using narrow-pitch connectors (common) acctb48e 201204-t regarding soldering 1. re?w soldering 1) measure the recommended pro?e temperature for re?w soldering by placing a sensor on the pc board near the connector surface or terminals. (the setting for the sensor will differ depending on the sensor used, so be sure to carefully read the instructions that comes with it.) 2) as for cream solder printing, screen printing is recommended. 3) to determine the relationship between the screen opening area and the pc- board foot pattern area, refer to the diagrams in the recommended patterns for pc boards and metal masks. make sure to use the terminal tip as a reference position when setting. avoid an excessive amount of solder from being applied, otherwise, interference by the solder will cause an imperfect contact. 4) consult us when using a screen- printing thickness other than that recommended. 5) when mounting on both sides of the pc board and the connector is mounting on the underside, use adhesives or other means to ensure the connector is properly ?ed to the pc board. (double re?w soldering on the same side is possible.) 6) n 2 re?w, conducting re?w soldering in a nitrogen atmosphere, increases the solder ?w too greatly, enabling wicking to occur. make sure that the solder feed rate and temperature pro?e are appropriate. soldering conditions please use the re?w temperature pro?e conditions recommended below for re?w soldering. please contact us before using a temperature pro?e other than that described below (e.g. lead-free solder). ?narrow-pitch connectors (except p8 type) ?narrow-pitch connector (p8) for products other than the ones above, please refer to the latest product speci?ations. 7) the temperatures are measured at the surface of the pc board near the connector terminals. (the setting for the sensor will differ depending on the sensor used, so be sure to carefully read the instructions that comes with it.) 8) the temperature pro?es given in this catalog are values measured when using the connector on a resin-based pc board. when performed re?w soldering on a metal board (iron, aluminum, etc.) or a metal table to mount on a fpc, make sure there is no deformation or discoloration of the connector beforehand and then begin mounting. 9) consult us when using a screen- printing thickness other than that recommended. 10) some solder and ?x types may cause serious solder creeping. solder and ?x characteristics should be taken into consideration when setting the re?w soldering conditions. 2. hand soldering 1) set the soldering iron so that the tip temperature is less than that given in the table below. 2) do not allow ?x to spread onto the connector leads or pc board. this may lead to ?x rising up to the connector inside. 3) touch the soldering iron to the foot pattern. after the foot pattern and connector terminal are heated, apply the solder wire so it melts at the end of the connector terminals. 4) be aware that soldering while applying a load on the connector terminals may cause improper operation of the connector. 5) thoroughly clean the soldering iron. 6) flux from the solder wire may get on the contact surfaces during soldering operations. after soldering, carefully check the contact surfaces and clean off any solder before use. 7) for soldering of prototype devices during product development, you can perform soldering at the necessary locations by heating with a hot-air gun by applying cream solder to the foot pattern beforehand. however, at this time, make sure that the air pressure does not move connectors by carefully holding them down with tweezers or other similar tool. also, be careful not to go too close to the connectors and melt any of the molded components. 8) if an excessive amount of solder is applied during manual soldering, the solder may creep up near the contact points, or solder interference may cause imperfect contact. 3. solder reworking 1) finish reworking in one operation. 2) for reworking of the solder bridge, use a soldering iron with a ?t tip. to prevent ?x from climbing up to the contact surfaces, do not add more ?x. 3) keep the soldering iron tip temperature below the temperature given in table a. te rm inal paste solder pc board foot pattern 60 to 120 sec. preheating peak temperature 200c 220c upper limited (solder heat resistance) peak temperature 260 c 230c 180c 150c 70 sec. 25 sec. lower limited (solder wettability) time temperature 60 to 120 sec. preheating time temperature peak temperature 200c 155 to 165c 245c max. within 30 sec. product name soldering iron temperature smd type connectors 300c within 5 sec. 350c within 3 sec. apply the solder wire here terminal pattern pc board small angle as possible up to 45 degrees soldering iron
panasonic corporation automation controls business unit industrial.panasonic.com/ac/e/ notes on using narrow-pitch connectors (common) acctb48e 201204-t handling single components storage of connectors other notes 1) make sure not to drop or allow parts to fall from work bench 2) excessive force applied to the terminals could cause warping, come out, or weaken the adhesive strength of the solder. handle with care. 3) repeated bending of the terminals may cause terminals to break. 4) do not insert or remove the connector when it is not soldered. forcibly applied external pressure on the terminals can w eaken the adherence of the terminals to the molded part or cause the terminals to lose their evenness. 5) excessive prying-force applied to one end may cause product breakage and separation of the solder joints at the terminal. excessive force applied for insertion in a pivot action as shown may also cause product breakage. align the header and socket positions before connecting them. cleaning ?x from pc board 1) to increase the cleanliness of the cleaning ?id and cleaning operations, prepare equipment for cleaning process beginning with boil cleaning, ultrasonic cleaning, and then vapor cleaning. 2) carefully oversee the cleanliness of the cleaning ?ids to make sure that the contact surfaces do not become dirty from the cleaning ?id itself. 3) since some powerful cleaning solutions may dissolve molded components of the connector and wipe off or discolor printed letters, we recommend aqua pura electronic parts cleaners. please consult us if you wish to use other types of cleaning ?ids. 4) please note that the surfaces of molded parts may whiten when cleaned with alcohol. handling the pc board ?handling the pc board after mounting the connector when cutting or bending the pc board after mounting the connector, be careful that the soldered sections are subjected to excessive force. the soldered areas should not be subjected to force. 1) to prevent problems from voids or air pockets due to heat of re?w soldering, av oid storing the connectors in areas of high humidity. when storing the connectors for more than six months, be sure to consider storage area where the humidity is properly controlled. 2) depending on the connector type, the color of the connector may vary from connector to connector depending on when it is produced. some connectors may change color slightly if subjected to ultraviolet rays during storage. this is normal and will not affect the operation of the connector. 3) when storing the connectors with the pc boards assembled and components alreeady set, be careful not to stack them up so the connectors are subjected to excessive forces. 4) avoid storing the connectors in locations with excessive dust. the dust may accumulate and cause improper connections at the contact surfaces. 1) these products are made for the design of compact and lightweight devices and therefore the thickness of the molded components has been made very thin. therefore, be careful during insertion and removal operations for excessive forces applied may damage the products. 2) dropping of the products or rough mishandling may bend or damage the terminals and possibly hinder proper re?w soldering. 3) before soldering, try not to insert or remove the connector more than absolutely necessary. 4) when coating the pc board after soldering the connector to prevent the deterioration of insulation, perform the coating in such a way so that the coating does not get on the connector. 5) there may be variations in the colors of products from different production lots. this is normal. 6) the connectors are not meant to be used for switching. 7) be sure not to allow external pressure to act on connectors when assembling pcbs or moving in block assemblies.
panasonic corporation automation controls business unit industrial.panasonic.com/ac/e/ notes on using narrow-pitch connectors (common) acctb48e 201204-t regarding sample orders to con?m proper mounting when ordering samples to con?m proper mounting with the placement machine, connectors are delivered in 50- piece units in the condition given right. consult a sale representative for ordering sample units. condition when delivered from manufacturing required number of products for sample production (unit 50 pcs.) embossed tape amount required for the mounting reel (delivery can also be made on a reel by customer request.) please refer to the latest product speci?ations when designing your product.

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